Professor J.K. Spelt
BASc MASc, Mechanical Engineer (Cal Tech),
PhD PEng
|

|
Areas of Research
Mechanics of materials and manufacturing processes
Current and recent projects include:
Microelectronics Packaging
- the dependence
of solder creep on state of stress, load and temperature
- solder joint
strength prediction
- thermal
fatigue models of plated-through-vias (PTVs) in printed circuit
boards and measurements of thermal fatigue life using air cycling
and IST tests
- accelerated
thermal fatigue testing and modeling of microelectronic solder
joints
- mechanics of
printed circuit board wave soldering and resulting board warpage
Tribology
- abrasive wear
and impact erosion associated with the vibratory finishing process
- abrasive jet
micro-machining of glass, silicon and polymers for microfluidic
and opto-electronic applications
Adhesive Bonding
- automotive
structural adhesive bonding including fracture mechanics, fatigue,
durability, and the failure of adhesive joints accompanied by
large-scale adherend yielding
Wood-based Materials
- analysis of
metal-plate wood truss connections
E-mail: spelt@mie.utoronto.ca
|
|